Data centres are undergoing a transformative evolution. Cooling technologies such as, direct-to-chip liquid cooling, immersion cooling and refrigerant-based phase-change cooling achieve equal or better thermal management than air and water-based systems, while drastically reducing evaporative water use. These technologies exploit the high latent heat of vaporisation of refrigerants, to transfer more heat from the source to atmosphere, when compared to using water as the primary transfer medium.
This evolution is also driven by escalating thermal rejection requirements of data racks. The rapid development of high-density compute workloads powered by advanced AI chips - exemplified by NVIDIA’s Blackwell, Rubin and Feynman series - means traditional cooling systems relying on water-based evaporative processes are unable to dissipate heat within the required response time, creating operational inefficiencies and increasing failure risks. We are now designing data centres that integrate new cooling technology that can dissipate higher thermal loads, within the same physical constraints of traditional data centre design.